Emerging from its bankruptcy restructuring, Wolfspeed, a global leader in silicon carbide (SiC) technology, has returned to the forefront of innovation. On January 13 in North Carolina, USA, the company officially announced the successful production of 300mm (12‑inch) monocrystalline silicon carbide wafers. This breakthrough not only marks its recovery from financial challenges and a return to stable operations but also unlocks new performance limits and manufacturing scale for high‑end semiconductor applications.

As a key driver of previous 8‑inch (200mm) SiC wafer technology, Wolfspeed holds deep expertise in large‑format SiC. The mass production of 12‑inch wafers overcomes critical size barriers and delivers multiple core advantages:

• In AI, these wafers can be used for wafer‑level high‑voltage power systems integrating advanced thermal management and active interconnects, precisely meeting the stringent demands of AI data centers.

• In consumer electronics, the large‑area SiC material serves as an ideal platform for next‑generation optical integration in XR systems.

• Furthermore, the larger wafer area significantly improves the production efficiency of SiC power devices, accelerating cost reduction and boosting adoption in high‑voltage applications such as new energy vehicles and 5G base stations.

Currently, SiC wafer technology is at a pivotal transition window, and the introduction of 12‑inch products will reshape the global supply chain landscape. Wolfspeed’s breakthrough not only strengthens its own competitiveness in the high‑end SiC materials segment but also injects powerful momentum into the global semiconductor industry's shift toward a more efficient, low‑carbon SiC era.

ICgoodFind : Wolfspeed’s achievement with 12‑inch SiC wafers is a milestone that will accelerate the deployment of high‑end applications and drive the advancement of the silicon carbide industry chain.