Intel 10M50DAF256C8G: A Comprehensive Overview of the MAX 10 FPGA for Embedded Systems

Release date:2025-11-18 Number of clicks:133

Intel 10M50DAF256C8G: A Comprehensive Overview of the MAX 10 FPGA for Embedded Systems

The Intel MAX 10 FPGA represents a significant evolution in non-volatile FPGA technology, merging the high integration of an FPGA with the convenience of flash-based configuration. The specific device Intel 10M50DAF256C8G encapsulates these advancements, offering a robust platform tailored for modern embedded systems. This article provides a detailed overview of its architecture, key features, and target applications.

As a member of the MAX 10 family, the 10M50DAF256C8G is built on a 55-nanometer process technology. The device nomenclature decodes its core characteristics: '10M50' indicates it belongs to the MAX 10 series with approximately 50,000 logic elements (LEs), 'F256' specifies the 256-pin FineLine BGA package, and 'C8G' denotes a commercial-grade temperature device with a speed grade of 8.

A defining feature of the MAX 10 FPGA is its non-volatile, flash-based configuration. Unlike SRAM-based FPGAs that require an external boot PROM, the MAX 10 instantly configures itself upon power-up, simplifying board design, reducing component count, and enhancing overall system security. The 10M50DAF256C8G integrates a rich set of embedded memory, including up to 1.7 Mb of user flash memory and 1.6 Mb of embedded RAM (M9K blocks), enabling efficient data storage and processing.

For embedded processing tasks, this FPGA is exceptionally well-equipped. It features a hard embedded memory controller supporting DDR2 and DDR3 SDRAM, facilitating high-bandwidth external memory access. Furthermore, many MAX 10 devices, including this variant, can host a soft-core Nios II processor, allowing designers to create a complete, custom System-on-a-Chip (SoC) solution within a single device.

The device boasts a comprehensive suite of analog and digital interfaces. It includes an embedded dual-configuration flash for storing two FPGA images, enabling reliable field updates and fail-safe recovery. It also integrates an on-chip analog-to-digital converter (ADC), which can monitor on-die temperature and external voltages, reducing the need for external analog components.

Target applications for the Intel 10M50DAF256C8G are vast and varied, spanning across industrial motor control, automotive infotainment, industrial automation and control, test and measurement equipment, and communication infrastructure. Its ability to consolidate logic, processing, memory, and analog interfaces makes it an ideal choice for system integration, reducing cost, power consumption, and board space.

ICGOODFIND: The Intel 10M50DAF256C8G MAX 10 FPGA stands out as a highly integrated, single-chip solution that blurs the line between FPGAs and microcontrollers. Its flash-based instant-on capability, embedded memory, hard IP controllers, and integrated analog features make it a powerful and efficient choice for a wide spectrum of embedded system designs, prioritizing reliability, security, and cost-effectiveness.

Keywords: MAX 10 FPGA, Non-Volatile Configuration, Embedded Systems, Nios II Processor, System-on-a-Chip (SoC)

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